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此单模拟开关设计用于1.65 V至5.5 VV CC 操作。
SN74LVC1G66器件可以处理模拟和数字信号。该器件允许双向传输幅度高达5.5 V（峰值）的信号。
NanoFree封装技术是IC封装概念的重大突破，使用该封装。
所有商标均归其所有各自所有者。
| Configuration |
| Number of Channels (#) |
| Power Supply Type |
| Vss (Min) (V) |
| Vss (Max) (V) |
| Vdd (Min) (V) |
| Vdd (Max) (V) |
| Ron (Typ) (Ohms) |
| Bandwidth (MHz) |
| Rating |
| Operating Temperature Range (C) |
| Package Size: mm2:W x L (PKG) |
| Package Group |
| Supply Range (Max) |
| Ron (Max) (Ohms) |
| Input/Output Continuous Current (Max) (mA) |
| Supply Current (Typ) (uA) |
| Supply Current (Max) (uA) |
| Features |
| OFF-state leakage current (Max) (µA) |
| ON-state leakage current (Max) (µA) |
| Input/Output ON-state Capacitance (Typ) (pF) |
| Input/Output OFF-state Capacitance (Typ) (pF) |
| ESD Charged Device Model (kV) |
| ESD HBM (kV) |
| VIL (Max) (V) |
| VIH (Min) (V) |
| SN74LVC1G66 | SN74LVC2G66 |
|---|---|
| 1:1 SPST | 1:1 SPST |
| 1 | 2 |
| Single | Single |
| N/A | N/A |
| N/A | N/A |
| 1.65 | 1.65 |
| 5.5 | 5.5 |
| 7.5 | 6 |
| 300 | 300 |
| Catalog | Catalog |
| -40 to 85 | -40 to 85 |
| See datasheet (DSBGA) 5SC70: 4 mm2: 2.1 x 2(SC70) See datasheet (SON) 5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23) 5SOT-5X3: 3 mm2: 1.6 x 1.6(SOT-5X3) | See datasheet (DSBGA) 8SM8: 12 mm2: 4 x 2.95(SM8) 8VSSOP: 6 mm2: 3.1 x 2(VSSOP) |
| DSBGA SC70 SON SOT-23 SOT-5X3 | DSBGA SM8 VSSOP |
| 5.5 | 5.5 |
| 120 | 30 |
| 50 | 50 |
| 1 | 1 |
| 10 | 15 |
| low tpd unbuffered | low tpd unbuffered |
| 1 | 1 |
| 1 | 1 |
| 13 | 14 |
| 6 | 6 |
| 1 | 2 |
| 2 | 1 |
| Vdd*.3 | Vdd*.3 |
| Vdd*.7 | Vdd*.7 |
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