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数据： Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amp With Shutdown 数据表
TLV247x是CMOS轨到轨输入/输出操作放大器系列，可为电源电流与交流性能建立新的性能点。这些器件仅消耗600μA/通道，同时提供2.8MHz的增益带宽产品。随着交流性能的提高，该放大器提供高输出驱动能力，解决了老式微功率运算放大器的主要缺点。 TLV247x可在每个电源轨的180mV范围内摆动，同时驱动10mA负载。对于非RRO应用，TLV247x可以在轨距为500mV时提供±35mA电流。输入和输出都是轨到轨摆动，以增加低压应用中的动态范围。这种性能使TLV247x系列成为传感器接口，便携式医疗设备和其他数据采集电路的理想选择。
PowerPAD是德州仪器公司的商标。
Microsim PARTS是MicroSim Corporation的商标。
Microsim PSpice是MicroSim Corporation的注册商标。
所有其他商标均为其各自所有者的财产。
| Number of Channels (#) |
| Total Supply Voltage (Min) (+5V=5, +/-5V=10) |
| Total Supply Voltage (Max) (+5V=5, +/-5V=10) |
| GBW (Typ) (MHz) |
| Slew Rate (Typ) (V/us) |
| Rail-to-Rail |
| Vos (Offset Voltage @ 25C) (Max) (mV) |
| Iq per channel (Typ) (mA) |
| Vn at 1kHz (Typ) (nV/rtHz) |
| Rating |
| Operating Temperature Range (C) |
| Package Group |
| Package Size: mm2:W x L (PKG) |
| Offset Drift (Typ) (uV/C) |
| Features |
| Input Bias Current (Max) (pA) |
| CMRR (Typ) (dB) |
| Output Current (Typ) (mA) |
| Architecture |
| TLV2471 | TLV2470 | TLV2471-Q1 | TLV2472 | TLV2472-Q1 | TLV2474 | TLV2474-Q1 | TLV2475 |
|---|---|---|---|---|---|---|---|
| 1 | 1 | 1 | 2 | 2 | 4 | 4 | 4 |
| 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 |
| 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 |
| 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
| In Out | In Out | In Out | In Out | In Out | In Out | In Out | In Out |
| 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 |
| 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 |
| 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 |
| Catalog | Catalog | Automotive | Catalog | Automotive | Catalog | Automotive | Catalog |
| -40 to 125 0 to 70 | -40 to 125 0 to 70 | -40 to 125 | -40 to 125 0 to 70 | -40 to 125 | -40 to 125 0 to 70 | -40 to 125 | -40 to 125 0 to 70 |
| PDIP SOIC SOT-23 | PDIP SOIC SOT-23 | SOT-23 | MSOP-PowerPAD PDIP SOIC | SOIC | HTSSOP PDIP SOIC | HTSSOP SOIC | HTSSOP PDIP SOIC |
| See datasheet (PDIP) 8SOIC: 29 mm2: 6 x 4.9(SOIC) 5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23) | See datasheet (PDIP) 8SOIC: 29 mm2: 6 x 4.9(SOIC) 6SOT-23: 8 mm2: 2.8 x 2.9(SOT-23) | 5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23) | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) See datasheet (PDIP) 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 14HTSSOP: 32 mm2: 6.4 x 5(HTSSOP) See datasheet (PDIP) 14SOIC: 52 mm2: 6 x 8.65(SOIC) | 14HTSSOP: 32 mm2: 6.4 x 5(HTSSOP) 14SOIC: 52 mm2: 6 x 8.65(SOIC) | 16HTSSOP: 32 mm2: 6.4 x 5(HTSSOP) See datasheet (PDIP) 16SOIC: 59 mm2: 6 x 9.9(SOIC) |
| 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 |
| N/A | Shutdown | N/A | N/A | N/A | N/A | N/A | Shutdown |
| 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 |
| 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 |
| 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 |
| CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
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