CC2564MODN 蓝牙双模式 HCI 模块

• Module Solution Based on TI's CC2564B Dual-Mode Bluetooth^®, Available in Two Variants:
  • CC2564MODA With Integrated Antenna
  • CC2564MODN With External Antenna
• Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
  • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
  • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
  • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
• Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
  • CC2564MODA
    • Integrated Chip Antenna
    • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
  • CC2564MODN
    • Single-Ended 50-Ω RF Interface
    • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
• BR and EDR Features Include:
  • Up to Seven Active Devices
  • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
  • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
  • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
  • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
  • Support of Multiple Bluetooth Profiles With Enhanced QoS
• Low Energy Features Include:
  • Support of up to 10 Simultaneous Connections
  • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
  • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
  • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
• Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
  • Class 1.5 TX Power up to +10 dBm
  • –93 dbm Typical RX Sensitivity
  • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
  • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
  • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
• Advanced Power Management for Extended Battery Life and Ease of Design
  • On-Chip Power Management, Including Direct Connection to Battery
  • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
  • Shutdown and Sleep Modes to Minimize Power Consumption
• Physical Interfaces:
  • UART Interface With Support for Maximum Bluetooth Data Rates
    • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
    • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
  • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
• CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

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