君正集成电路 M200嵌入式主板简介

嵌入式主板

君正集成电路

•移动设备级的性能XBurst CPU双核 (1.2GHz/300MHz) •可穿戴式设备级的超低功耗 (0.07mW/MHz) •可穿戴设备级的超小封装 (7.7 x 8.9 x 0.76 mm) •内置语音唤醒引擎

芯片框图

芯片规格

CPU	XBurst-HP core, 1.2GHz (MIPS-based). XBurst-LP core, 300MHz (MIPS-based). 32KB L1 I-cache and 32KB L1 D-cache for each core. 512KB L2 unified cache.
GPU	3D GPU with OpenGL ES 2.0/1.1 compliant. 2D GPU with OpenVG 1.1 compliant.
VPU	Video encoder: H.264, VP8, 720P@30fps. Video decoder: H.264, MPEG-4, MPEG-1/2, VC-1, RV9, VP8, 720P@30fps.
ISP	Wide Dynamic Range (EDR), dual-stream processing. Video and still image stabilization. Image cropping and rescaling. Auto exposure and gain control. Auto white balancing and auto focus control. Edge sharpening and advanced noise reduction. Color correction and management. Auto contrast enhancement and Gamma correction. Special digital effects.
Memory	DDR2, DDR3, LPDDR, LPDDR2, up to 667Mbps. 16 and 32 bit external DDR data width. 64-bit ECC NAND flash support, 512B/2KB/4KB/8KB/16KB page size. Toggle1.0 and ONFI2.0 NAND. 2 channels high performance PDMA, and 30 channels general purpose DMA.
Display	LCD controller with OSD: TFT, SLCD and MIPI-DSI (2-lanes). Embedded E-Ink controller.
Camera	MIPI-CSI2 (2-lanes) and DVP interface.
Audio	Embedded audio CODEC. Low power DMIC controller. AC97/I2S/SPDIF interface for external audio codec. PCM interface, master and slave mode.
Voice Trigger Engine	System wakeup on specific voice command, programmable.
ADC	3 channels SAR A/D controller, 12-bit resolution.
On-chip Peripherals	USB 2.0 OTG. MMC/SD/SDIO controller. Full-duplex UART port. Synchronous serial interface. Two-wire SMB serial interface.
Security	Total 4KB OTP memory. Highest lever 1 security boot.
Package	BGA270, 7.7 x 8.9 x 0.76 (mm), 0.4mm pitch.
OS	Android 5.1 and beyond.