Agilent Medalist x6000 Automat

• The Agilent Medalist x6000 AXI
 system offers extensive simul-
 taneous 3D X-ray inspection of
 double-sided panels at throughput
 rates that match most line rates of
 medium to high complexity printed
 circuit board assemblies (PCBA).
• Provides uncompromised 3D
 inspection for maximum fault
 detection up to 95% of all manu-
 facturing defects.
• Designed for in-line or off-line
 automated X-ray process testing
 of lead or lead-free solder joints
 on PCBAs, with user confi  gurable
 pass-thru or pass-back loading.
• Enables successful implementa-
 tions through an easy-to-learn
 and easy-to-use development
 environment providing faster
 time-to-market with high
 quality results.
• Digital cross-sectional X-ray images
 of solder joints are automatically
 generated and analyzed. The
 dynamic analysis measures joint
 characteristics and compares
 results against both learned and
 user defi  ned thresholds.