电子元器件封装中的界面控制技术

概述了电子设备行业为了实现小型、轻量化与高速、大容量的信息传输，对电子元器件及装 置实施小型化、高密度组装、微细导线、最短连线所需的三维组装和立体电路成形技术。论述了电子 元器件组装中所采用的高分子材料及对其高性能的期望、金属与高分子材料的连接所应用的界面 控制技术。讨论了界面控制技术的具体应用，如多层线路板、半导体密封材料、异向性导电连接材 料、半导体制造工程用粘结带等。
关键词：系统内组装；微内部连接；高分子材料；粘结带；集成电路
Abstract：Make a brief introduction of electric equipment industry S new technology for information transfer from small size and light weight to high speed and capacity，and tridimensional assembly and electrocircult technology for electric component and instrument S need of miniaturization， high density， micro wire and the shortest wire splice．Dissertate macromolecular material and expect for its perform ance，and interface
control technology of metal and macromolecular material connect．Also refor to interface control technology application such as multi—layers board， multi—conductor package material， the different tropism electric conduction material，adhesives tape for multi-conductor manufacture and SO on．
Key word：system in package；micro interconnection；polymer；adhesive tape； integrated circui