印制电路板的电磁兼容性设计

随着电子技术的飞速发展，高密度、高频率的电子产品迅猛增长，势必导致电磁环境的进一步恶化，从而引起一系列的电磁兼容问题。本文以电磁兼容为主线，以消除各部分电路之间的干扰、降低印制电路板（PCB）的传导发射和辐射发射为目的，对PCB 的抗干扰设计进行了综合分析确保产品顺利通过电磁兼容测试。
关键词: 印制电路板电磁兼容布局 布线 静电防护
中图分类号：TN973.3 文献标识号：A
Electro Magnetic Compatibility Design of Printed Circuit Board
ZHOU Bin1 ZHAO Xiaoyun2
（1、Guilin University of Electronic Technology, Guilin 541004, China）
（2、HENAN XIFEI ELECTRIC CO.,LTD , XinXiang 453002, China）
Abstract: As the fast development of electronic technology, electronic products of high density and high frequency increase rapidly. This will bring on a further deterioration of the electromagnetic environment and cause a series of electromagnetic compatibility problems. To eliminate the interference between every part of circuit and reduce the conductive emission and radiation emission, EMC design of PCB are widely overviewed,which will ensure the products pass the electro magnetic compatibility testing.
Key words: Printed Circuit Board (PCB)；Electromagnetic Compatibility(EMC)；Layout；routing；ESD