越小越好：小型化射频- 1部分

　　越小越好：小型化射频- 1部分

　　为了提供全球覆盖和满足市场需求，智能手机，平板电脑和其他移动设备必须支持更多的RF频段比以往任何时候和功能越来越多的无线功能。尽管事实上，他们的RF电路变得更加复杂，这些设备必须保持紧凑，如果不是更紧凑的每一个新的模式。考虑到这一点，设计师们认识到，更高的频率的好处之一是，组件可以得到更小。具体而言，天线和电感器可以缩小到表面贴装和PCB尺寸。集成电路，也可以贡献，并促成了这一收缩的过程几何允许完整的RF部分无缝集成的数字功能与模拟领域的RF调制，解调，天线匹配和波传播。

　　本文着眼于小型化的一些关键组件和系统，将允许设计师的下一代无线链路（您好，物联网！）提供更小更高效的无线电和无线电子系统。在这一部分1部分，我们看最新的无源元件，集成几个离散部分变小，表面贴装版本，节省空间和成本，提高性能。

　　These components are useful with modern， highly integrated standard radio link transceiver chips that already offer small-size solutions. Since these established standards are on their third or fourth generation， integrated passives are highly optimized and include miniature front ends， filters， baluns， and other assorted parts that can serve single-standard solutions like Wi-Fi， or multistandard protocols like Wi-Fi Bluetooth combinations.

　　In Part 2， we will look at active components such as RF transistors， mixers， modulators， and amplifiers for next-generation radios. These pieces of a radio may be useful for prototyping and even production of special function radio links that are not highly standardized. Here， SoC-style multichip modules or carrier boards can be used to more accurately preserve impedances and antenna characteristics. It should be noted that if high-volume manufacturing is to take place， more integrated custom silicon may be the best solution to reduce cost and size until the IC makers catch up. Even in this case， the components discussed here will still be useful. All parts， data sheets， tutorials， and development kits referenced here are available online at Digi-Key’s website.