带隙基准电路的研究

本文阐述了Banba 和Leung 两种基本带隙基准电压源电路的工作原理，分析了Leung
结构对于Banba 结构改进的方法，分别对两个电路的参数进行了设计，并仿真其性能，由此来比较了它们各自的特点。得到的结论是Banba 结构的输出电压温度系数更小，而Leung结构的最低电源电压可以降到1V 左右，有益于向低电压设计的发展。仿真采用SMIC0.18um 标准CMOS Spice 工艺模型在Hspice 中进行，两者的输出电压都在0.5V 左右，温度系数在10e-5 数量级，成品受到其他非理想因素的影响，温度系数会大一点。由于时间和设备有限，暂时无法实现成成品，所以目前所有指标都是仿真理想值。
关键词—能隙源，低电压，温度无关

Two bandgap circuits – a Banba one and a Leung one are presented in this work. It also
includes the analysis of their working principles and the design of the perimeters, the simulation of their functions. At last, it compares their differences. The former one bears less temperature dependence and the later can lower the minimum supply voltage to about 1V, which could be used for low voltage design. This work is simulated by Hspice with the SMIC 0.18um technology. Both of the reference voltages generated are about 0.5V. Their temperature
coefficient is about 10e-5, but the product after manufacture may be influenced by other
imperfect aspects. Since the limits of time and devices, I have only got the last product of these circuits, so the results printed are all simulation results.
Index Terms——Bandgap reference, low voltage, temperature independent