模块化选择简化和未来的M2M，Wi-Fi和ZigBee连接的证明

　　模块化选择简化和未来的M2M，Wi-Fi和ZigBee连接的证明

　　机器对机器（M2M）连接的预测确定了数十亿美元的医疗、工业、家庭、智能电网交换数据的设备，以及尚未定义的市场。由于地理位置优越，遗产的改造，和地理，大多数M2M连接将无线，依靠IP包和IPv6寻址，和发生在WPAN ZigBee®或无线局域网Wi-Fi®网络。随着创新的M2M应用和无线协议的发展，模块化的单芯片和双芯片集成电路正在跟上“未来的”设计。本文探讨了一些ZigBee和Wi-Fi芯片组的特点和系统分区。

　　物联网

　　“物联网”描述了一个未来，各种设备相互连接，交换有意义的数据，越来越没有人的干预。为每个基于微控制器的子系统分配地址将导致比任何人都能计算出更独特的连接节点，但在未来几年中肯定会达到数十亿。这些所谓的M2M业务中有很大一部分是基于IP的，松耦合的发生，相对接近2.4 GHz和5 GHz无线个域网和WLAN网络由ZigBee和Wi-Fi。ZigBee提供了高达250 kbps的数据速率和极低的功率的好处，而Wi-Fi拥有卓越的速度高达600 Mbps的已经或易于安装的消费设备，但牺牲成本和功率。

　　Yet the M2M growth phenomenon is characterized by this key fact： rapid change and evolution. No one knows exactly what systems or devices will be interconnected， or what kind of data will be exchanged. New systems and ideas are rapidly emerging， favoring modular approaches to chipset implementations. RF standards like 802.11ac （Wi-Fi） continue to evolve by adding channels， bandwidth， and security， while application-specific protocols such as ZigBee Smart Energy V2.0 are gaining traction in other venues such as powerline， automotive， and Wi-Fi.

　　For the reasons previously mentioned， chipset vendors are offering modular solutions for ZigBee and Wi-Fi M2M connectivity. In some instances， the MCU/MPU is separate from the RF section and connected by a standard UART or SPI interface. This allows swapping out either the processor or the radio or maintaining backwards legacy code compatibility. In other cases， a mixed-signal single-chip SoC is modularized or upgraded with freely available vendor protocol libraries and applications stacks. In this article， we’ll take a look at several IC manufacturers’ offerings and consider them in terms of board footprint， power consumption， RF performance， ZigBee protocols， Wi-Fi protocols， and available development tools.