射频电路应用设计的关键性课题

射频电路应用设计的关键性课题:1.  Interference and Isolation 
      o  Existence of Interference in Circuitry
      o  Definition and Measurement of Isolation
      o  Main Path of Interference in a RF Module
      o  Main Path of Interference in a IC Die
2.  Shielding for a RF Module by a Metallic Shielding Box
3.  Strong Desirability to Develop RFIC
4.   Interference Going Along IC Substrate Path
      o  Experimentation
      o  Trench
      o  Guard Ring
5.  Solution for Interference Coming from the Sky
6.  Common Grounding Rules for RF Module and RFIC Design
      o  Grounding of Circuit-branches or Blocks in Parallel
      o  DC Power Supply to Circuit-branches or Blocks in Parallel
7.  Bottlenecks in RFIC
      o  Low Q Inductor and Possible Solution
      o  “Zero” Capacitors
      o  Bonding Wires
8.  Prospect of SOC
9.  What is Next?
Appendixes
     o  Notes about RFIC layout
     o  Calculation of Quarter Wavelength
     o  Progress of Electronic Industry