硅片传输定位机器人的设计

本文针对大直径硅片的高速自动化生产对硅片的高效、高精度、高可靠性传输要求，确定基于3 自由度的R-θ型硅片传输定位机器人方案，设计了大直径硅片传输定位机器人系统。在设计过程中，通过采用基于丝杠花键轴的升降旋转机构、采用周转轮系传递臂体的伸缩动力等措施，解决了现有同类传输机器人系统中存在的刚性低、结构复杂等问题。此外，本文通过运动学分析证明了径向伸缩部件的直线运动轨迹；利用拉格朗日的分析力学的方法对该部件的模型进行了动力学分析，得出动力矩方程。调试结果表明，该机器人的径向伸缩运动的直线精度达到了使用要求。
关键词: 硅片传输机器人；机构；运动学分析；动力学分析

Abstract: To satisfy the high efficiency, high precision and high reliability requirement
of transfering and positioning the large-diameter silicon slices in high speed wafer
manufacturing , the R-θtype wafer robot based on 3 DOF is adopted, and the wafer robot is
designed. In the design, the rolling ball screw & the ball spline pair are used as actuating
mechanism in the up-down rotary component. The epicyclic gear train is adopted to drive
the arm to move along line. The new design improves the rigidity of structure of the system
and simplify the mechanism. Furthermore,the kinematic of the linear mechanism of radial
stretch component is analyzed to prove its moving track which moves along line. The model
of the componet is analyzed with Largrange method to achieve the equation of drive torque.
The testing shows that the line accuracy of radial linear stretch component satisfy the
parctical requirement.
Keywords:Wafer robot；Mechanism；Kinematics analysis；Dynamic analysis