印制电路词汇

印制电路词汇

一、综合词汇 1、印制电路：printedcircuit 2、印制线路：printedwiring 3、印制板：printedboard 4、印制板电路：printedcircuitboard(PCB) 5、印制线路板：printedwiringboard(PWB) 6、印制元件：printedcomponent 7、印制接点：printedcontact 8、印制板装配：printedboardassembly 9、板：board 10、单面印制板：single-sidedprintedboard(SSB) 11、双面印制板：double-sidedprintedboard(DSB) 12、多层印制板：mulitlayerprintedboard(MLB) 13、多层印制电路板：mulitlayerprintedcircuitboard 14、多层印制线路板：mulitlayerpritedwiringboard 15、刚性印制板：rigidprintedboard 16、刚性单面印制板：rigidsingle-sidedprintedborad 17、刚性双面印制板：rigiddouble-sidedprintedborad 18、刚性多层印制板：rigidmultilayerprintedboard 19、挠性多层印制板：flexiblemultilayerprintedboard 20、挠性印制板：flexibleprintedboard 21、挠性单面印制板：flexiblesingle-sidedprintedboard 22、挠性双面印制板：flexibledouble-sidedprintedboard 23、挠性印制电路：flexibleprintedcircuit(FPC) 24、挠性印制线路：flexibleprintedwiring 25、刚性印制板：flex-rigidprintedboard,rigid-flexprintedboard 26、刚性双面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted 27、刚性多层印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard 28、齐平印制板：flushprintedboard 29、金属芯印制板：metalcoreprintedboard 30、金属基印制板：metalbaseprintedboard 31、多重布线印制板：mulit-wiringprintedboard 32、陶瓷印制板：ceramicsubstrateprintedboard 33、导电胶印制板：electroconductivepasteprintedboard 34、模塑电路板：moldedcircuitboard 35、模压印制板：stampedprintedwiringboard 36、顺序层压多层印制板：sequentially-laminatedmulitlayer 37、散线印制板：discretewiringboard 38、微线印制板：microwireboard 39、积层印制板：buile-upprintedboard 40、积层多层印制板：build-upmulitlayerprintedboard(BUM) 41、积层挠印制板：build-upflexibleprintedboard 42、表面层合电路板：surfacelaminarcircuit(SLC) 43、埋入凸块连印制板：B2itprintedboard 44、多层膜基板：multi-layeredfilmsubstrate(MFS) 45、层间全内导通多层印制板：ALIVHmultilayerprintedboard 46、载芯片板：chiponboard(COB) 47、埋电阻板：buriedresistanceboard 48、母板：motherboard 49、子板：daughterboard 50、背板：backplane 51、裸板：bareboard 52、键盘板夹心板：copper-invar-copperboard 53、动态挠性板：dynamicflexboard 54、静态挠性板：staticflexboard 55、可断拼板：break-awayplanel 56、电缆：cable 57、挠性扁平电缆：flexibleflatcable(FFC) 58、薄膜开关：membraneswitch 59、混合电路：hybridcircuit 60、厚膜：thickfilm 61、厚膜电路：thickfilmcircuit 62、薄膜：thinfilm 63、薄膜混合电路：thinfilmhybridcircuit 64、互连：interconnection 65、导线：conductortraceline 66、齐平导线：flushconductor 67、传输线：transmissionline 68、跨交：crossover 69、板边插头：edge-boardcontact 70、增强板：stiffener 71、基底：substrate 72、基板面：realestate 73、导线面：conductorside 74、元件面：componentside 75、焊接面：solderside 76、印制：printing 77、网格：grid 78、图形：pattern 79、导电图形：conductivepattern 80、非导电图形：non-conductivepattern 81、字符：legend 82、标志：mark 二、基材： 1、基材：basematerial 2、层压板：laminate 3、覆金属箔基材：metal-cladbadematerial 4、覆铜箔层压板：copper-cladlaminate(CCL) 5、单面覆铜箔层压板：single-sidedcopper-cladlaminate 6、双面覆铜箔层压板：double-sidedcopper-cladlaminate 7、复合层压板：compositelaminate 8、薄层压板：thinlaminate 9、金属芯覆铜箔层压板：metalcorecopper-cladlaminate 10、金属基覆铜层压板：metalbasecopper-cladlaminate 11、挠性覆铜箔绝缘薄膜：flexiblecopper-claddielectricfilm 12、基体材料：basismaterial 13、预浸材料：prepreg 14、粘结片：bondingsheet 15、预浸粘结片：preimpregnatedbondingsheer 16、环氧玻璃基板：epoxyglasssubstrate 17、加成法用层压板：laminateforadditiveprocess 18、预制内层覆箔板：masslaminationpanel 19、内层芯板：corematerial 20、催化板材：catalyzedboard,coatedcatalyzedlaminate 21、涂胶催化层压板：adhesive-coatedcatalyzedlaminate 22、涂胶无催层压板：adhesive-coateduncatalyzedlaminate 23、粘结层：bondinglayer 24、粘结膜：filmadhesive 25、涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm 26、无支撑胶粘剂膜：unsupportedadhesivefilm 27、覆盖层：coverlayer(coverlay) 28、增强板材：stiffenermaterial 29、铜箔面：copper-cladsurface 30、去铜箔面：foilremovalsurface 31、层压板面：uncladlaminatesurface 32、基膜面：basefilmsurface 33、胶粘剂面：adhesivefaec 34、原始光洁面：platefinish 35、粗面：mattfinish 36、纵向：lengthwisedirection 37、模向：crosswisedirection 38、剪切板：cuttosizepanel 39、酚醛纸质覆铜箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL) 40、环氧纸质覆铜箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL) 41、环氧玻璃布基覆铜箔板：epoxidewovenglassfabriccopper-cladlaminates 42、环氧玻璃布纸复合覆铜箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates 43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates 44、聚酯玻璃布覆铜箔板：ployesterwovenglassfabriccopper-cladlaminates 45、聚酰亚胺玻璃布覆铜箔板：polyimidewovenglassfabriccopper-cladlaminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates 47、环氧合成纤维布覆铜箔板：epoxidesyntheticfiberfabriccopper-cladlaminates 48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiberglasscopper-cladlaminates 49、超薄型层压板：ultrathinlaminate 50、陶瓷基覆铜箔板：ceramicsbasecopper-cladlaminates 51、紫外线阻挡型覆铜箔板：UVblockingcopper-cladlaminates 三、基材的材料 1、A阶树脂：A-stageresin 2、B阶树脂：B-stageresin 3、C阶树脂：C-stageresin 4、环氧树脂：epoxyresin 5、酚醛树脂：phenolicresin 6、聚酯树脂：polyesterresin 7、聚酰亚胺树脂：polyimideresin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazineresin 9、丙烯酸树脂：acrylicresin 10、三聚氰胺甲醛树脂：melamineformaldehyderesin 11、多官能环氧树脂：polyfunctionalepoxyresin 12、溴化环氧树脂：brominatedepoxyresin 13、环氧酚醛：epoxynovolac 14、氟树脂：fluroresin 15、硅树脂：siliconeresin 16、硅烷：silane 17、聚合物：polymer 18、无定形聚合物：amorphouspolymer 19、结晶现象：crystallinepolamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic 23、热固性树脂：thermosettingresin 24、热塑性树脂：thermoplasticresin 25、感光性树脂：photosensitiveresin 26、环氧当量：weightperepoxyequivalent(WPE) 27、环氧值：epoxyvalue 28、双氰胺：dicyandiamide 29、粘结剂：binder 30、胶粘剂：adesive 31、固化剂：curingagent 32、阻燃剂：flameretardant 33、遮光剂：opaquer 34、增塑剂：plasticizers 35、不饱和聚酯：unsatuiatedpolyester 36、聚酯薄膜：polyester 37、聚酰亚胺薄膜：polyimidefilm(PI) 38、聚四氟乙烯：polytetrafluoetylene(PTFE) 39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(FEP) 40、增强材料：reinforcingmaterial 41、玻璃纤维：glassfiber 42、E玻璃纤维：E-glassfibre 43、D玻璃纤维：D-glassfibre 44、S玻璃纤维：S-glassfibre 45、玻璃布：glassfabric 46、非织布：non-wovenfabric 47、玻璃纤维垫：glassmats 48、纱线：yarn 49、单丝：filament 50、绞股：strand 51、纬纱：weftyarn 52、经纱：warpyarn 53、但尼尔：denier 54、经向：warp-wise 55、纬向：weft-wise,filling-wise 56、织物经纬密度：threadcount 57、织物组织：weavestructure 58、平纹组织：plainstructure 59、坏布：greyfabric 60、稀松织物：wovenscrim 61、弓纬：bowofweave 62、断经：endmissing 63、缺纬：mis-picks 64、纬斜：bias 65、折痕：crease 66、云织：waviness 67、鱼眼：fisheye 68、毛圈长：featherlength 69、厚薄段：mark 70、裂缝：split 71、捻度：twistofyarn 72、浸润剂含量：sizecontent 73、浸润剂残留量：sizeresidue 74、处理剂含量：finishlevel 75、浸润剂：size 76、偶联剂：couplintagent 77、处理织物：finishedfabric 78、聚酰胺纤维：polyarmidefiber 79、聚酯纤维非织布：non-wovenpolyesterfabric 80、浸渍绝缘纵纸：impregnatinginsulationpaper 81、聚芳酰胺纤维纸：aromaticpolyamidepaper 82、断裂长：breakinglength 83、吸水高度：heightofcapillaryrise 84、湿强度保留率：wetstrengthretention 85、白度：whitenness 86、陶瓷：ceramics 87、导电箔：conductivefoil 88、铜箔：copperfoil 89、电解铜箔：electrodepositedcopperfoil(EDcopperfoil) 90、压延铜箔：rolledcopperfoil 91、退火铜箔：annealedcopperfoil 92、压延退火铜箔：rolledannealedcopperfoil(RAcopperfoil) 93、薄铜箔：thincopperfoil 94、涂胶铜箔：adhesivecoatedfoil 95、涂胶脂铜箔：resincoatedcopperfoil(RCC) 96、复合金属箔：compositemetallicmaterial 97、载体箔：carrierfoil 98、殷瓦：invar 99、箔（剖面）轮廓：foilprofile 100、光面：shinyside 101、粗糙面：matteside 102、处理面：treatedside 103、防锈处理：stainproofing 104、双面处理铜箔：doubletreatedfoil 四、设计 1、原理图：shematicdiagram 2、逻辑图：logicdiagram 3、印制线路布设：printedwirelayout 4、布设总图：masterdrawing 5、可制造性设计：design-for-manufacturability 6、计算机辅助设计：computer-aideddesign.(CAD) 7、计算机辅助制造：computer-aidedmanufacturing.(CAM) 8、计算机集成制造：computerintegratmanufacturing.(CIM) 9、计算机辅助工程：computer-aidedengineering.(CAE) 10、计算机辅助测试：computer-aidedtest.(CAT) 11、电子设计自动化：electricdesignautomation.(EDA) 12、工程设计自动化：engineeringdesignautomaton.(EDA2) 13、组装设计自动化：assemblyaidedarchitecturaldesign.(AAAD) 14、计算机辅助制图：computeraideddrawing 15、计算机控制显示：computercontrolleddisplay.(CCD) 16、布局：placement 17、布线：routing 18、布图设计：layout 19、重布：rerouting 20、模拟：simulation 21、逻辑模拟：logicsimulation 22、电路模拟：circitsimulation 23、时序模拟：timingsimulation 24、模块化：modularization 25、布线完成率：layouteffeciency 26、机器描述格式：machinedescriptionmformat.(MDF) 27、机器描述格式数据库：MDFdatabse 28、设计数据库：designdatabase 29、设计原点：designorigin 30、优化（设计）：optimization(design) 31、供设计优化坐标轴：predominantaxis 32、表格原点：tableorigin 33、镜像：mirroring 34、驱动文件：drivefile 35、中间文件：intermediatefile 36、制造文件：manufacturingdocumentation 37、队列支撑数据库：queuesupportdatabase 38、元件安置：componentpositioning 39、图形显示：graphicsdispaly 40、比例因子：scalingfactor 41、扫描填充：scanfilling 42、矩形填充：rectanglefilling 43、填充域：regionfilling 44、实体设计：physicaldesign 45、逻辑设计：logicdesign 46、逻辑电路：logiccircuit 47、层次设计：hierarchicaldesign 48、自顶向下设计：top-downdesign 49、自底向上设计：bottom-updesign 50、线网：net 51、数字化：digitzing 52、设计规则检查：designrulechecking 53、走（布）线器：router(CAD) 54、网络表：netlist 55、计算机辅助电路分析：computer-aidedcircuitanalysis 56、子线网：subnet 57、目标函数：objectivefunction 58、设计后处理：postdesignprocessing(PDP) 59、交互式制图设计：interactivedrawingdesign 60、费用矩阵：costmetrix 61、工程图：engineeringdrawing 62、方块框图：blockdiagram 63、迷宫：moze 64、元件密度：componentdensity 65、巡回售货员问题：travelingsalesmanproblem 66、自由度：degreesfreedom 67、入度：outgoingdegree 68、出度：incomingdegree 69、曼哈顿距离：manhattondistance 70、欧几里德距离：euclideandistance 71、网络：network 72、阵列：array 73、段：segment 74、逻辑：logic 75、逻辑设计自动化：logicdesignautomation 76、分线：separatedtime 77、分层：separatedlayer 78、定顺序：definitesequence 五、形状与尺寸： 1、导线（通道）：conduction(track) 2、导线（体）宽度：conductorwidth 3、导线距离：conductorspacing 4、导线层：conductorlayer 5、导线宽度/间距：conductorline/space 6、第一导线层：conductorlayerNo.1 7、圆形盘：roundpad 8、方形盘：squarepad 9、菱形盘：diamondpad 10、长方形焊盘：oblongpad 11、子弹形盘：bulletpad 12、泪滴盘：teardroppad 13、雪人盘：snowmanpad 14、V形盘：V-shapedpad 15、环形盘：annularpad 16、非圆形盘：non-circularpad 17、隔离盘：isolationpad 18、非功能连接盘：monfunctionalpad 19、偏置连接盘：offsetland 20、腹（背）裸盘：back-bardland 21、盘址：anchoringspaur 22、连接盘图形：landpattern 23、连接盘网格阵列：landgridarray 24、孔环：annularring 25、元件孔：componenthole 26、安装孔：mountinghole 27、支撑孔：supportedhole 28、非支撑孔：unsupportedhole 29、导通孔：via 30、镀通孔：platedthroughhole(PTH) 31、余隙孔：accesshole 32、盲孔：blindvia(hole) 33、埋孔：buriedviahole 34、埋/盲孔：buried/blindvia 35、任意层内部导通孔：anylayerinnerviahole(ALIVH) 36、全部钻孔：alldrilledhole 37、定位孔：toalinghole 38、无连接盘孔：landlesshole 39、中间孔：interstitialhole 40、无连接盘导通孔：landlessviahole 41、引导孔：pilothole 42、端接全隙孔：terminalclearomeehole 43、准表面间镀覆孔：quasi-interfacingplated-throughhole 44、准尺寸孔：dimensionedhole 45、在连接盘中导通孔：via-in-pad 46、孔位：holelocation 47、孔密度：holedensity 48、孔图：holepattern 49、钻孔图：drilldrawing 50、装配图：assemblydrawing 51、印制板组装图：printedboardassemblydrawing 52、参考基准：datumreference