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| 软件名称 |
to-220封装尺寸数据参数 |
| 运行环境 |
Win9X/Win2000/WinXP/Win2003/ |
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| 整理时间 |
2008-6-17 11:36:14 |
| 软件星级 |
 |
| 软件语言 |
简体中文 |
| 软件类型 |
国产软件 |
| 授权方式 |
共享软件 |
| 软件大小 |
555 KB |
| 相关连接 |
csb23@126.com 官方主页 没有预览图片
[收 藏] |
| 下载统计 |
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| 解压密码 |
www.elecfans.com |
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 软件简介 |
to-220封装尺寸数据参数TO 220 Leadbend Options
National Semiconductor offers several types of enhanced
packages. One with high popularity is the TO-220 package
designed with exposed heat sink for efficient heat dissipation.
Examples of some products used in this package are voltage
regulators, comparators, and high current switches. The
TO-220 package is offered in lead counts from 3 to 15. To
provide flexibility on system board applications, several leadbend
options are offered as shown.
For any TO-220 package, please check with your sales representative
for availability of requested leadbend options.
Note:
• Surface Mount Leadform available as TO-263 package.
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