LAYOUT REPORT .............. 1

目錄.................. 1

1. PCB LAYOUT 術語解釋(TERMS)......... 2

2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2

3. 基準點 (光學點) -for SMD:........... 4

4. 標記 (LABEL ING)......... 5

5. VIA HOLE PAD................. 5

6. PCB Layer 排列方式...... 5

7.零件佈置注意事項 (PLACEMENT NOTES)............... 5

8. PCB LAYOUT 設計............ 6

9. Transmission Line ( 傳輸線 )..... 8

10.General Guidelines – 跨Plane.. 8

11. General Guidelines – 繞線....... 9

12. General Guidelines – Damping Resistor. 10

13. General Guidelines - RJ45 to Transformer................. 10

14. Clock Routing Guideline........... 12

15. OSC & CRYSTAL Guideline........... 12

16. CPU 􀃎 RAM􀃎FLASH 14

17. General Guidelines –Decoupling Capacitor............. 14

18.POWER 部分.................... 15

19. GND & Vcc Plan 切割................... 17

20. DRC : Design Rule Check........... 19

21. CAM 輸出/輸出文件(參考gerber file 流程圖)................ 20

22. 其他注意事項............. 21

23.PCB 製作規範填寫注意事項............ 23