设 计（Design）

IPC-M-106

Technology Reference for Design Manual
设计技术手册

IPC-2220

Design Standard Series
设计标准系列手册

IPC-2221A

Generic Standard on Printed Board Design
印制板设计通用标准

IPC-2222

Sectional Standard on Rigid Organic Printed Boards
刚性有机印制板设计分标准

IPC-2223

Sectional Design Standard for Flexible Printed Boards
挠性印制板设计分标准

IPC-2224

Sectional Standard of Design of PWB for PC Card
PC卡用印制电路板分设计分标准

IPC-2225

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
有机多芯片模块(MCM-L)及其组装件设计分标准

IPC-SM-782A

Surface Mount Design and Land Pattern Standard--Includes Amendments 1 & 2
表面安装设计及连接盘图形标准(包括修订1和2)

IPC-D-859

Design Standard for Thick Film Multilayer Hybrid Circuits
厚膜多层混合电路设计标准

IPC-1902

IPC/IEC Grid Systems for Printed Circuits IPC/IEC印制电路网格体系

IPC-2615

Printed Board Dimensions and Tolerances
印制板尺寸和公差

IPC-D-322

Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
使用标准在制板尺寸的印制板尺寸选择指南

IPC-2531

Standard Recipe File Format Specification
SMEMA发布： 标准“菜单”（过程控制）文件格式规范
注：SMEMA{The Surface Mount Equipment Manufacturers Association merged with IPC}

IPC-2541

Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication
电子制造车间现场设备信息沟通(CAMX)通用要求

IPC-2546

Sectional Requirements for Specific Printed Circuit Board Assembly Equipment
特殊印制板组装设备分要求

IPC-2571

Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)
电子制造供应链信息沟通分要求 产品数据交换

IPC-2511A

Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology
实施产品制造数据描述及其传输方法学的通用要求

IPC-D-356B

Bare Board Electrical Test Data Format
裸基板电检测的数据格式

印 制 电 路 板
（Printed Circuit Boards）

IPC-M-105

Rigid Printed Board Manual
刚性印制板设计手册

IPC-D-325A

Documentation Requirements for Printed Boards 印制板设计文件图册要求

IPC-PE-740A

Troubleshooting for Printed Board Manufacture and Assembly
印制板制造和组装的故障排除

IPC-6010 Series

IPC-6010 Qualification and Performance Series
IPC-6010印制电路板质量标准和性能规范系列手册

IPC-6011

Generic Performance Specification for Printed Boards
印制板通用性能规范

IPC-6013-K

Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1）

IPC-6016

Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范

IPC-6012A-AM

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1)

IPC-6018A

Microwave End Product Board Inspection and Tech
微波成品印制板的检验和测试

IPC-6015

Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections
有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范

IPC-A-600F

Acceptability of Printed Boards
印制板验收条件

IPC-HM-860

Specification for Multilayer Hybrid Circuits
多层混合电路规范

IPC-TF-870

Qualification and Performance of Polymer Thick Film Printed Boards
聚合物厚膜印制板的鉴定与性能

IPC-ML-960

Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范

IPC-DR-572

Drilling Guidelines for Printed Boards
印制板钻孔导则

IPC-NC-349

Computer Numerical Control Formatting for Drillers and Routers
钻床和铣床用计算机数字控制格式

IPC-SM-839

Pre & Post Solder Mask Application Cleaning Guidelines
施加阻焊前及施加后清洗导则

IPC/JPCA-4104

Specification for High Density Interconnect (HDI) and Microvia Materials
高密度互连(HDI)及微导通孔材料规范

IPC-6016

Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范

IPC/JPCA-6801

IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection
积层/高密度互连的术语和定义、试验方法与设计例

IPC-DD-135

Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
多芯片组件内层有机绝缘材料的鉴定试验

IPC-4103

Specification for Base Materials for High Speed/High Frequency Applications
高速高频用基材规范

IPC-6018A

Microwave End Product Board Inspection and Test
微波成品印制板的检验和测试

IPC-D-317A

Design Guidelines for Electronic Packaging Utilizing High Speed Techniques
采用高速技术电子封装设计导则

IPC-M-102

Flexible Circuits Compendium
挠性电路纲要

IPC-4202

Flexible Base Dielectrics for Use in Flexible Printed Circuitry
挠性印制线路用挠性绝缘基底材料

IPC-4203

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
挠性印制线路覆盖层用涂粘接剂绝缘薄膜

IPC-4204

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
挠性金属箔去电应用于柔性电路组装

IPC-6013-K

Qualification & Performance Specification for Flexible Printed Boards & Amendment 1
挠性印制板的鉴定与性能规范（包括修改单1）

IPC/JPCA-6202

IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
IPC/JPCA单双面挠性印制板性能手册

IPC-FC-234

Composite Metallic Materials Specification for Printed Wiring Boards
印制线路板复合金属材料规范

IPC-M-107

Standards for Printed Board Materials Manual 印制板材料标准手册

IPC-4101A

Specifications for Base Materials for Rigid and Multilayer Printed Boards
刚性及多层印制板用基材规范

IPC-4121

Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则

IPC-4562

Metal Foil for Printed Wiring Applications
印制线路用金属箔

IPC-CF-148A

Resin Coated Metal for Printed Boards
印制板用涂树脂金属箔

IPC-CF-152B

Composite Metallic Materials Specification for Printed Wiring Boards
印制线路板复合金属材料规范

IPC-4412

Specification for Finished Fabric Woven from ”E” Glass for Printed Boards
“E”类精纺玻璃纤维层印制板技术规范

IPC-4130

Specification & Characterization Methods for Nonwoven "E" Glass Materials
E 玻璃纤维非织布材料规范及性能确定方法

IPC-4110

Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
印制板用纤维纸规范及性能确定方法

IPC-4411-K

Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1
聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1

IPC-4411-AM1

Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1
关于聚芳基酰胺非织布规范及性能确定方法的修改单 1

IPC-SG-141

Specification for Finished Fabric Woven from "S" Glass for Printed Boards
印制板用经处理S玻璃纤维织物规范

IPC-A-142

Specification for Finished Fabric Woven from Aramid for Printed Boards
印制板用经处理聚芳酰胺纤维编织物规范

IPC-QF-143

Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
印制板用经处理石英（熔融纯氧化硅）纤维编织物规范

IPC-2524

PWB Fabrication Data Quality Rating System
印制板制造数据质量定级体系

IPC-9191

General Guidelines for Implementation of Statistical Process Control (SPC)
实施统计过程控制(SPC)的通用导则

IPC-9252

Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
未组装印制板电测试要求和指南

IPC-MS-810

Guidelines for High Volume Microsection
大批量显微剖切导则

IPC-QL-653A

Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
印制板、元器件及材料检验试验设备的认证

IPC-TR-486

Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation
内层分离的互连应力测试(IST)与显微剖切相关性联合研究