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美国制定加强出口管制计划,意在阻止“中国制造2025”战略

2018年08月29日 15:16 次阅读

此前,应用材料、科磊(KLA-Tencor)、MKS Instruments、泰瑞达(Teradyne)等半导体设备厂商的股价纷纷下跌,ASML最高下跌了4.71%。这与美国国家安全会议、美国商务部拟加强技术出口管制有着一定的关系。

其实,本月早些时候美国政府发布加征关税商品清单后,便有分析师指出,美国可能宣布对出口到中国的商品实施新的管制,若包括中国芯片制造商需要的半导体材料等,这将对芯片类股票产生重大影响。如今,恰恰印证了这一点。

华尔街日报称,美国财政部正在起草规定,对于白宫所称的参与“工业重要技术”的公司,将禁止中资股权在25%或更高的公司对其展开收购。此外,美国国家安全委员会和商务部正在制定加强出口管制的计划,意在阻止这类技术出口到中国。这两项计划将于本周结束前公布,意在阻止“中国制造2025”战略列出的项目。

目前看,半导体设备是否会被特朗普政府纳入出口管制清单尚不清楚。但是透过以上半导体设备厂商的股价表现,可以看到市场对此表现出的担心。

前十大半导体设备厂商中,美国厂商占据了近一半的席位。而半导体设备一直是我国最薄弱的一个环节,主要依赖于进口。

在我国大力发展半导体产业的背景下,国际半导体设备厂商纷纷表示要助力中国半导体成长,并看好自身在中国市场的机遇。据Cowen & Co.分析师Krish Sankar的统计数据,在中国市场,应用材料、MKS Instruments、泰瑞达、科磊、科林(Lam Research)、ASML分别带来了21%、19%、18%、17%、15%、9%、7%的营收。

穆迪(Moody`s)分析师Richard Lane认为,如果美国政府真的限制厂商将半导体设备出售给中国,我国的芯片企业根本找不到可替代的供应商,无法获取生产线所需要的尖端设备。

若特朗普政府将半导体设备纳入出口管制清单,受伤的将不止是中国半导体企业。以科磊和科林为例,2018财年第3季度,中国市场占科磊营收比重高达19%,为仅次于韩国的第二大市场;中国市场占科林比重高达17%,为其全球第二大市场。

尽管美国半导体设备供应商的对我国半导体企业而言至关重要,但我国设备制造商也在逐渐崛起,其制造技术水平已经取得一定进步。据悉,在8英寸制造的主要关键设备方面,刻蚀机、离子注入机、薄膜生长设备、氧化炉、LPCVD、退火炉、清洗机、单晶生长设备、CMP设备、封装设备等产品基本形成国内配套能力,技术水平基本可以满足用户要求。预计今年将有40多种装备可以通过生产一线用户的考核,并进入采购程序;部分国产12英寸设备在生产线上实现批量应用。

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SN74AHCT139 双路 2 线路至 4 线...

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The CD74HCT4543 high-speed silicon-gate is a BCD-to-7 segment latch/decoder/driver designed primarily for directly driving liquid-crystal displays. While the latch enable (LD) is low, the latches are enabled to store the BCD inputs. When the latch enable is high, the latches are disabled, making the outputs transparent to the BCD inputs. The device has an active-high blanking input (BI) and a phase input (PH) to which a square wave is applied for liquid-crystal applications. This square wave also is applied to the backplane of the liquid-crystal display. 特性 4.5-V to 5.5-V VCC Operation Input Latches for BCD Code Storage Blanking Capability Phase Input for Complementing Outputs Fanout (Over Temperature Range) Standard Outputs - 10 LSTTL Loads Balanced Propagation De...

发表于 2018-08-28 11:23 0次阅读
CD74HCT4543 用于 LCD 的高速 C...

电科装备正式发布“SEMICORE烁科”系列品牌...

面向国家战略需求,在中国电科“1+8”品牌体系建设的部署下,电科装备形成了中国电科“电科装备—装备制...

发表于 2018-08-28 10:44 316次阅读
电科装备正式发布“SEMICORE烁科”系列品牌...

核心技术到底是个啥?芯片原理和量子力学

作为“工业之母”的高端机床,土工基本和男国足一个水平,只能仰望日本德国瑞士。材料是最大的限制之一,比...

发表于 2018-08-28 10:33 269次阅读
核心技术到底是个啥?芯片原理和量子力学

浅析陈立武在半导体投资的新思路

华登国际的投资史可谓战功赫赫。据陈立武先生表示,其华登国际这三十年历史中,大概投了500多家公司,其...

发表于 2018-08-28 09:34 158次阅读
浅析陈立武在半导体投资的新思路

东旭光电发展高端装备及技术服务业务,获8000万...

东旭光电与京东方盛源光电、武汉华星光电、厦门天马、视涯科技四家公司分别签订总额近8000万元人民币高...

发表于 2018-08-28 08:41 736次阅读
东旭光电发展高端装备及技术服务业务,获8000万...

业界要闻:集成电路产业加速谋局、硅晶圆供货持续吃...

行业大事在身边 瑞势带你半导体硅晶圆供应吃紧,客户纷纷签订长约确保料源,环球晶圆客户预付货款高达新台...

发表于 2018-08-28 08:36 279次阅读
业界要闻:集成电路产业加速谋局、硅晶圆供货持续吃...

盘点中国集成电路现状及未来发展趋势

8月24日,超摩尔研究室主任朱邵歆博士代表中国电子信息产业发展研究院发布《中国集成电路2018年上半...

发表于 2018-08-28 07:59 358次阅读
盘点中国集成电路现状及未来发展趋势

后摩尔时代,半导体的新战场与新机会

来源:智东西公开课智东西公开课推出的AI芯片系列课完结第五讲,华登国际合伙人王林就主题《人工智能带来...

发表于 2018-08-27 19:01 531次阅读
后摩尔时代,半导体的新战场与新机会

董明珠500亿“造芯”只为梦想

今年4月份,格力电器在发布年报时首次明确表示未来要发展集成电路,当时望靖东在电话会议中表示,中兴通讯...

发表于 2018-08-27 17:34 277次阅读
董明珠500亿“造芯”只为梦想

首届智博会举行重大项目集中签约仪式,合计投资约6...

8月23日,首届中国国际智能产业博览会(简称智博会)举行了重大项目集中签约仪式。据主办方统计,现场集...

发表于 2018-08-27 17:22 512次阅读
首届智博会举行重大项目集中签约仪式,合计投资约6...

三星半导体事业屡屡刷新业绩,平泽厂5月再添DRA...

2017年三星电子(Samsung Electronics)半导体事业屡屡刷新业绩,高达65兆韩元(...

发表于 2018-08-27 16:57 293次阅读
三星半导体事业屡屡刷新业绩,平泽厂5月再添DRA...

富士通助力无线无电池应用,FRAM RFID的创...

前不久,富士通半导体有限公司系统存储设计开发部FRAM RFID高级工程师罗建在2018第十四届RF...

发表于 2018-08-27 16:32 296次阅读
富士通助力无线无电池应用,FRAM RFID的创...

中美贸易谈判结束,互征关税政策生效

中美两国官员周四结束为期两天的贸易谈判,与此同时,美国华盛顿时间 23 日 0 时 1 分(中国北京...

发表于 2018-08-27 16:29 1470次阅读
中美贸易谈判结束,互征关税政策生效

美国政府禁止ASML招收中国员工

在中兴制裁刚平息不久,中美贸易战剑拔弩张的时候。这则新闻出来了以后,刺激整个中国大陆半导体从业人员的...

发表于 2018-08-27 16:23 303次阅读
美国政府禁止ASML招收中国员工

扇出型晶圆级封装是什么?有哪些优点?

伴随FOWLP,如今我们才有能力在这些模片上嵌入一些异构设备包括基带处理器,射频收发器和电源管理IC...

发表于 2018-08-27 16:04 237次阅读
扇出型晶圆级封装是什么?有哪些优点?

倒装芯片和晶片级封装技术及其应用

发表于 2018-08-27 15:45 26次阅读
倒装芯片和晶片级封装技术及其应用

在全球化的芯片产业中,中国的机会在哪里?

在芯片全球化的背景下,中国一定要尽最大努力在芯片若干领域掌握核心技术,努力实现一些技术突破,做到“我...

发表于 2018-08-27 15:37 263次阅读
在全球化的芯片产业中,中国的机会在哪里?

半导体专业赛落地张家港 打造地方新特色

总规模148亿元的张家港基金正式启动,基金将主要聚焦于新材料、新能源、生物科技三大产业,科技引领将在...

发表于 2018-08-27 14:17 27次阅读
半导体专业赛落地张家港 打造地方新特色

支持功率因数校正和反激拓扑的新型950 V Co...

更高密度的低功率SMPS设计需要越来越多的高压MOSFET器件。英飞凌科技股份公司(FSE: IFX...

发表于 2018-08-27 14:15 499次阅读
支持功率因数校正和反激拓扑的新型950 V Co...

半导体新闻合集:中国集成电路行业平均月薪9120...

本周是中国半导体行业艰难的一周,我国集成电路面临急缺人才的现状;澳大利亚拒绝华为中兴供应5G网络设备...

发表于 2018-08-27 11:50 654次阅读
半导体新闻合集:中国集成电路行业平均月薪9120...

汽车半导体分立器件市场分析

美国:美国半导体分立器件目前居于全球领先地位,拥有一大批如TI、Diodes、Fairchild(被...

发表于 2018-08-27 11:36 515次阅读
汽车半导体分立器件市场分析

新思科技亮相2018中国智博会 推出汽车电子智能...

新思科技宣布,受邀参加于2018年8月23日至25日在重庆国际博览中心举办的“2018中国国际智能产...

发表于 2018-08-27 08:48 618次阅读
新思科技亮相2018中国智博会 推出汽车电子智能...

英特尔不行了?错觉罢了

昨天,英特尔中国研究院院长宋继强博士在接受TechSugar等媒体的采访时,给出了很多铿锵有力的回答...

发表于 2018-08-26 11:39 685次阅读
英特尔不行了?错觉罢了

我国半导体技术的有一步发展世界上最大口径单体碳化...

历时15年探索攻关、9年立项研制,中国科学家打破国外技术封锁和产品垄断,研制成功世界上迄今公开报道的...

发表于 2018-08-26 11:00 434次阅读
我国半导体技术的有一步发展世界上最大口径单体碳化...

2018 NI半导体测试技术创新论坛 - 南京站

针对于RFIC、ADC等混合信号芯片探讨如何通过PXI平台化方法降低从实验室到量产测试成本、提高测试...

发表于 2018-08-26 09:14 390次阅读
2018 NI半导体测试技术创新论坛 - 南京站

硒化铋:引导半导体变革的新材料

研究人员利用明尼苏达大学独特的高分辨率透射电子显微镜技(TEM)研究了这种材料。化学工程与材料科学副...

发表于 2018-08-25 11:44 89次阅读
硒化铋:引导半导体变革的新材料

三菱电机半导体新型功率模块具有哪些特点?

自上世纪八十年代后期推出IGBT模块后,三菱电机至今已成功将第七代IGBT模块推向市场。在持续性和创...

发表于 2018-08-25 11:36 642次阅读
三菱电机半导体新型功率模块具有哪些特点?

新型封装组件DFN3030-10B冷却柱形,具有...

特瑞仕半导体株式会社,于2018年7月举行了冷却柱形新型封装组件DFN3030-10B的首次出厂仪式...

发表于 2018-08-25 11:11 288次阅读
新型封装组件DFN3030-10B冷却柱形,具有...

镇宁自治县半导体元器件生产项目签约仪式正式举行

签约仪式上,黄昌福对公司一行的到来表示热烈欢迎,并指出,自江苏宇胜科教设备有限公司到镇宁考察洽谈镇宁...

发表于 2018-08-25 11:07 123次阅读
镇宁自治县半导体元器件生产项目签约仪式正式举行

东芝SD存储卡N203实现256GB的超大存储容...

自数字化革命爆发以来,国内外数字化存储市场格局也随之发生改变,越来越多的消费群体开始追求更高效安全的...

发表于 2018-08-24 18:31 782次阅读
东芝SD存储卡N203实现256GB的超大存储容...

台湾面板将进入OLED新世代

默克是半导体与面板材料的龙头大厂,中国台湾默克集团董事长谢志宏表示,台湾地区半导体产业不断往更先进制...

发表于 2018-08-24 18:27 772次阅读
台湾面板将进入OLED新世代

晶圆制造基础原材料硅片相关探讨

世界头两名集成电路用硅片制造商都集中于日本,信越(Shin-Etsu)和SUMCO,占全球60以上%...

发表于 2018-08-24 16:43 386次阅读
晶圆制造基础原材料硅片相关探讨

丁文武:高端核心芯片基本上依赖于进口

我跟一些集成电路企业界朋友聊天,我问他们,中国在高端芯片方面落后或者有差距,到底是什么原因?是人才的...

发表于 2018-08-24 16:38 748次阅读
丁文武:高端核心芯片基本上依赖于进口

盘点欧美国家集成电路发展概况

美国是半导体技术的发源地。半导体产业建立之初主要为了应对二次世界大战,当时美国开始对电子和材料进行研...

发表于 2018-08-24 14:53 1466次阅读
盘点欧美国家集成电路发展概况

2018上半年全球半导体TOP15销售排名:中国...

2018年上半年中,前15家公司中有14家的销售额至少为40亿美元,比上半年增加了3家。如图所示,仅...

发表于 2018-08-24 14:53 499次阅读
2018上半年全球半导体TOP15销售排名:中国...

晨星电视芯片产品线将与联发科电视芯片部门合併

此外,外界认为联发科也在替AIoT世代布局,原因在于未来举凡智能音箱、汽车、家庭智能装置及电视等产品...

发表于 2018-08-24 14:43 1178次阅读
晨星电视芯片产品线将与联发科电视芯片部门合併

SN74HC4851 具有注入电流影响控制的 8...

This eight-channel CMOS analog multiplexer/demultiplexer is pin compatible with the ’4051 function and, additionally, features injection-current effect control, which has excellent value in automotive applications where voltages in excess of normal supply voltages are common. The injection-current effect control allows signals at disabled analog input channels to exceed the supply voltage without affecting the signal of the enabled analog channel. This eliminates the need for external diode/resistor networks typically used to keep the analog channel signals within the supply-voltage range. 特性 Injection-Current Cross Coupling <1mV/mA (see Figure 1) Low Crosstalk Between Switches Pin Compatible With SN74HC4051, SN74LV4051A, and CD4051B 2-V to 6-V VCC Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 2000-V Human-Body Model (A114-A) 200-V Machine Model (A...

发表于 2018-08-24 14:32 0次阅读
SN74HC4851 具有注入电流影响控制的 8...

SN74LV4052A-Q1 汽车类双路 4 通...

These dual 4-channel CMOS analog multiplexers and demultiplexers are designed for 2-V to 5.5-V VCC operation. The SN7LV4052A-Q1 devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak). Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. 特性 Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results: Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range Device HBM ESD Classification Level 2 Device CDM ESD Classification Level C4B Supports Mixed-Mode Voltage Operation on All Ports Fast Switching High On-Off Output-Voltage Ratio Low Crosstalk Between Switches Extremely Low Input Current 参数 与其它产品相比 模拟开关/多路复用器   Configuration Number of Cha...

发表于 2018-08-24 14:29 0次阅读
SN74LV4052A-Q1 汽车类双路 4 通...

SN74AUC2G53 单极、双闸 (SPDT)...

This analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC operation. The SN74AUC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. 特性 Available in the Texas Instruments NanoFree™ Package Operates at 0.8 V to 2.7 V Sub-1-V Operable Low Power Consumption, 10 µA at 2.7 V High On-Off Output Voltage Ratio High Degree of Linearity Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 2000-V Human-Body Model (A114-A) 200-V Machine Model (...

发表于 2018-08-24 14:28 0次阅读
SN74AUC2G53 单极、双闸 (SPDT)...

SN74LV4051A-Q1 汽车类 8 通道模...

This 8-channel CMOS analog multiplexer and demultiplexer is designed for 2-V to 5.5-V VCC operation. The SN74LV4051A handles analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. 特性 Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range Device HBM ESD Classification Level 2 Device CDM ESD Classification Level C4B 2-V to 5.5-V VCC Operation Supports Mixed-Mode Voltage Operation on All Ports High On-Off Output-Voltage Ratio Low Crosstalk Between Switches Individual Switch Controls Extremely Low Input Current Latch-Up Performance Ex...

发表于 2018-08-24 14:27 0次阅读
SN74LV4051A-Q1 汽车类 8 通道模...

SN74LV4053A-Q1 汽车类三路 2 通...

This triple 2-channel CMOS analog multiplexer/demultiplexer is designed for 2-V to 5.5-V VCC operation. The SN74LV4053A handles both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. 特性 Qualified for Automotive Applications ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) 2-V to 5.5-V VCC Operation Supports Mixed-Mode Voltage Operation on All Ports High On-Off Output-Voltage Ratio Low Crosstalk Between Switches Individual Switch Controls Extremely Low Input Current 参数 与其它产品相比 模拟开关/多路复用器   Configuration Number of Channels (#) Power Supply Type Vs...

发表于 2018-08-24 14:26 12次阅读
SN74LV4053A-Q1 汽车类三路 2 通...

纵向加速度传感器工作原理介绍

车身纵向加速度传感器的作用是检测车辆起步加速或制动减速时车辆发生“抬头”或“点头”的现象,以控制前、...

发表于 2018-08-24 11:56 38次阅读
纵向加速度传感器工作原理介绍

FBP封装是什么?和QFN封装有什么区别?

FBP的基本想法是:用L/F本身的金属材料形成薄膜替代耐高温塑料膜,是否就可以解决上述QFN工艺生产...

发表于 2018-08-24 11:50 130次阅读
FBP封装是什么?和QFN封装有什么区别?

智能卡的芯片是怎样进行封装的?

当芯片被压焊之后,就用黑色的环氧树脂灌注在芯片上和模块背后的表面上。树脂保护易碎的晶体免于环境影响,...

发表于 2018-08-24 11:45 101次阅读
智能卡的芯片是怎样进行封装的?

美国掀起半导体人才大战,迫使ASML拒招中国籍员...

8月21日晚,某微博大V收到了粉丝投稿,大意是他的一个朋友被荷兰光刻机巨头ASML公司拒收简历,回复...

发表于 2018-08-24 10:34 420次阅读
美国掀起半导体人才大战,迫使ASML拒招中国籍员...

中韩能否打破欧洲真空配件系统垄断地位?

近日VLSI Research的报告显示,真空泵、压力表和真空阀一起,构成了半导体OEM厂商(即晶圆...

发表于 2018-08-24 10:30 306次阅读
中韩能否打破欧洲真空配件系统垄断地位?

探讨集成电路PPA和APP结合对半导体产业投资的...

集成电路产业是大脑和心脏,传感器是五官和四肢,算法是意识和灵魂,三者共同构成电子信息技术的核心底层。

发表于 2018-08-24 08:49 600次阅读
探讨集成电路PPA和APP结合对半导体产业投资的...

半导体制造过程後段(Back End)后工序

发表于 2018-08-23 19:07 67次阅读
半导体制造过程後段(Back End)后工序

2018年世界半导体设备投资额预计将达到627....

据SEMI年中预测报道:2018年晶圆制程(前段)加工设备投资预计为508亿美元,同比增长11.7%...

发表于 2018-08-23 17:31 821次阅读
2018年世界半导体设备投资额预计将达到627....

三极管的三只脚如何区分 常用三极管的管脚定义

表调到1K挡,黑表笔接任意一脚,不动,红表笔测另外两脚,当测得另外两脚阻值在10K左右时,这时,黑表...

发表于 2018-08-23 17:25 260次阅读
三极管的三只脚如何区分 常用三极管的管脚定义

CC2533 用于 2.4GHz IEEE 80...

The CC2533 is an optimized system-on-chip (SoC) solution for IEEE 802.15.4 based remote-control systems. It enables single-chip remote controls to be built with low bill-of-material cost when used as a flexible SoC. It also provides a simple path to adding RF4CE capability to a device or target when used in the wireless network processor configuration of the RemoTI RF4CE stack. Robust network nodes can be built with very low total bill-of-material costs. The CC2533 combines the excellent performance of a leading RF transceiver with a single-cycle 8051 compliant CPU, up to 96-KB in-system programmable flash memory, up to 6-KB RAM, and many other powerful features. The CC2533 has efficient power modes with RAM and register retention below 1 µA, making it highly suited for low-duty-cycle systems where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption. Combin...

发表于 2018-08-21 18:44 18次阅读
CC2533 用于 2.4GHz IEEE 80...

半年狂赚近2千亿,全球半导体会呈现“T”型吗?

发表于 2018-08-21 18:31 626次阅读
半年狂赚近2千亿,全球半导体会呈现“T”型吗?

TRPGR30ATGA TRPGR30ATGA ...

德州仪器 (TI) 23mm 低频 (LF) 玻璃应答器提供出色性能并可在 134.2kHz 的共振频率上运行。 此产品兼容 ISO/IEC 11784/11785 全球开放式标准。 德州仪器 (TI) LF 玻璃应答器使用 TI 获专利的调谐制造工艺生产以提供持续的读取性能。 送货前,将对此应答器进行全面的功能和参数测试,为用户提供他们所期望从 TI 获得的高质量产品。 特性 由获专利的半双工 (HDX) 技术提供的同类产品中最佳性能 获专利的应答器调谐提供稳定的和高读取性能 80 位只读类型 64 位芯片 ID 对几乎所有非金属物质不敏感 应用范围 车辆识别 集装箱跟踪 资产管理 参数 与其它产品相比 其他无线技术   Frequency Device Type Standard Transmission Principle Operating Temperature Range (C) Approx. Price (US$) Rating   var link = "zh_CN_folder_p_quick_link_description_features_parametrics"; com.TI.Product.handleQuickLinks('parametric','参数变化','#parametrics',link); TRPGR30ATGA 134.2 kHz     Transponder     ISO11785     HDX - FS...

发表于 2018-08-20 18:04 12次阅读
TRPGR30ATGA TRPGR30ATGA ...

RF-HDT-AJLE Tag-it™ HF-I...

The Tag-it HF-I Standard Transponder IC is part of the TI 13.56 MHz product family which is based on the ISO/IEC 15693 standard for contactless integrated circuit cards (vicinity cards) and ISO/IEC 18000-3 standard for item management. The Tag-it HF-I Standard Transponder IC builds the basis for various available inlay shapes which are used as consumable smart labels in markets requiring quick and accurate identification of items. User data is written to and read from memory blocks using a non-volatile EEPROM silicon technology. Each block is separately programmable by the user and can be locked to protect data from modification. Once the data has been ‘locked’ then it cannot be changed. To give some examples, information about delivery checkpoints and timing, place of origin/destination, pallet assignments, inventory numbers and even transportation routes can be coded into the transponder. Multiple transponders, which appear in the...

发表于 2018-08-20 18:01 17次阅读
RF-HDT-AJLE Tag-it™ HF-I...

RF-HDT-DVBE 基于 Tag-it HF...

Texas Instruments’ 13.56-MHz encapsulated standard transponder is compliant with the ISO/IEC 15693 and ISO/IEC 18000-3 global open standards. This product offers a user accessible memory of 256 bits, organized in 8 blocks, and an optimized command set. Designed for harsh environments, such as garment tracking in laundries, each transponder has a 64-bit factory programmed Read Only Number, which is also laser engraved on the transponder housing. Prior to delivery, transponders undergo complete functional and parametric testing to provide the high quality that customers have come to expect from TI. The 13.56-MHz encapsulated standard transponders are well suited for a variety of applications including, but not limited to, laundry garment tracking, process automation, product authentication, and asset management. 特性 ISO/IEC 15693-2,-3; ISO/IEC 18000-3 Compliant 13.56-MHz Operating Frequency 256-Bit User Memory in 8 × 32-Bit ...

发表于 2018-08-20 17:58 20次阅读
RF-HDT-DVBE 基于 Tag-it HF...

RI-ACC-008B RI-RFM-008B,...

The RI-RFM-007B radio frequency power module is capable driving a variety of antennas with inductance ranges from 26.0µH to 27.9µH including TI standard antennas RI-ANT-G01E, RI-ANT-G02E, RI-ANT-G04E gate antennas as well as RI-ANT-S01C and RI-ANT-S02C stick antennas.The RI-RFM-007B module in combination with a control module is well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications. 特性 Common Variable Power Supply RangeSynchronization Control in Multi-Reader ArraysHigh Power OutputStandard RFM Capacitive Tuning to ResonanceSupports Antenna Cable Lengths Up to 10 Meters (Depending on Antenna Design)Remote Antenna RFMSupports Antenna Cable Lengths Up to 120 Meters Capacitive and Inductive Tuning to Resonance 参数 与其它产品相比 其他无...

发表于 2018-08-20 17:58 16次阅读
RI-ACC-008B RI-RFM-008B,...

RF430CL331H RF430CL331H ...

德州仪器 (TI) 动态近场通信 (NFC)/射频识别 (RFID) 接口应答器 RF430CL331H 是一款 NFC 标签类型 4 器件,可结合一个非接触式 NFC/RFID 接口和一个有线 I2C 接口将器件连接到主机。NDEF 消息可通过集成的 I2C 串行通信接口读写,也可通过支持高达 848kbps 速率的集成 ISO/IEC 14443 标准类型 B RF 接口进行非接触式访问或更新。 该器件按主机控制器的需求请求响应 NFC 类型 4 命令,每次仅在其缓存中存储部分 NDEF 消息。这使得 NDEF 消息的大小仅受主机控制器的存储器容量以及规范的限制。 该器件支持读缓存、预取和写自动确认 功能, 可提高数据吞吐量。 该器件可利用简单而直观的 NFC 连接切换来替代载波方式,只需一次点击操作即可完成诸如 , 低功耗 (BLE) 或 Wi-Fi 的配对过程或认证过程。 作为一个常见 NFC 接口,RF430CL331H 使得终端设备能够与启用 NFC 的智能手机、平板电脑和笔记本电脑这类快速发展的基础设施进行通信。 特性 通过直通操作向主机控制器发送数据更新和请求 I2C 接口允许对内部静态随机存取存储器 (SRAM) 进行读写操作 预取、缓存和自动应答 特性 提高数...

发表于 2018-08-20 17:57 29次阅读
RF430CL331H RF430CL331H ...

CC8531 用于无线数字音频流的 PurePa...

The PurePath™ Wireless platform is a cost-effective and low-power solution optimized for wireless transmission of high-quality digital audio. The CC85xx includes a robust built-in wireless audio transmission protocol and can control selected external audio devices. Utilizing numerous coexistence mechanisms allows the CC85xx to avoid interfering with, or being interfered by other 2.4 GHz radio systems. The CC85xx operates autonomously, and can be used with or without an external MCU. An external host processor can be connected through SPI and control some aspects of its operation. The CC85xx interfaces easily with other TI audio ICs and DSPs (using I2S and DSP/TDM interfaces). More details can be found in the CC85xx Family User Guide. 特性 Built-in Audio Protoco CD-Quality Uncompressed Audio Excellent Robustness and Co-Existence Through Multiple Techniques Adaptive Frequency Hopping Forward ErrorCorrection B...

发表于 2018-08-20 17:55 9次阅读
CC8531 用于无线数字音频流的 PurePa...

RI-RFM-007B RI-RFM-007B,...

The RI-RFM-007B radio frequency power module is capable driving a variety of antennas with inductance ranges from 26.0µH to 27.9µH including TI standard antennas RI-ANT-G01E, RI-ANT-G02E, RI-ANT-G04E gate antennas as well as RI-ANT-S01C and RI-ANT-S02C stick antennas.The RI-RFM-007B module in combination with a control module is well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications. 特性 Common Variable Power Supply RangeSynchronization Control in Multi-Reader ArraysHigh Power OutputStandard RFM Capacitive Tuning to ResonanceSupports Antenna Cable Lengths Up to 10 Meters (Depending on Antenna Design)Remote Antenna RFMSupports Antenna Cable Lengths Up to 120 Meters Capacitive and Inductive Tuning to Resonance 参数 与其它产品相比 其他无...

发表于 2018-08-20 17:54 19次阅读
RI-RFM-007B RI-RFM-007B,...

CC3200MOD SimpleLink Wi-...

Start your design with the industry’s first programmable FCC, IC, CE, and Wi-Fi Certified Wireless microcontroller (MCU) module with built-in Wi-Fi connectivity. Created for the Internet of Things (IoT), the SimpleLink CC3200MOD is a wireless MCU module that integrates an ARM Cortex-M4 MCU, allowing customers to develop an entire application with a single device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for faster development. The CC3200MOD integrates all required system-level hardware components including clocks, SPI flash, RF switch, and passives into an LGA package for easy assembly and low-cost PCB design. The CC3200MOD is provided as a complete platform solution including software, sample applications, tools, user and programming guides, reference designs, and the TI E2E support community The applications MCU subsystem contains an industry...

发表于 2018-08-20 17:53 21次阅读
CC3200MOD SimpleLink Wi-...

RI-INL-R9QM 24mm 圆形 Inla...

Texas Instruments 24 mm LF circular disk inlays provide superior performance and operate at a resonance frequency of 134.2 kHz. The products are compliant to ISO/IEC 11784/11785 global open standards. Texas Instruments LF inlays are manufactured with TI’s patented tuning process to provide consistent read and write performance. Prior to delivery, the inlays undergo complete functional and parametric testing, in order to provide the high quality customers have come to expect from TI. The inlays are well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications, and for various encapsulation processes. 特性 Best in Class Performance Through Patented HDX (Half Duplex) Technology Patented Transponder Tuning Provides Stable and High Read/Write Performance 64 Bit Read Only, 80 Bit Read/Write Insensi...

发表于 2018-08-20 17:53 9次阅读
RI-INL-R9QM 24mm 圆形 Inla...

RI-RFM-008B RI-RFM-008B,...

The RI-RFM-007B radio frequency power module is capable driving a variety of antennas with inductance ranges from 26.0µH to 27.9µH including TI standard antennas RI-ANT-G01E, RI-ANT-G02E, RI-ANT-G04E gate antennas as well as RI-ANT-S01C and RI-ANT-S02C stick antennas.The RI-RFM-007B module in combination with a control module is well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications. 特性 Common Variable Power Supply RangeSynchronization Control in Multi-Reader ArraysHigh Power OutputStandard RFM Capacitive Tuning to ResonanceSupports Antenna Cable Lengths Up to 10 Meters (Depending on Antenna Design)Remote Antenna RFMSupports Antenna Cable Lengths Up to 120 Meters Capacitive and Inductive Tuning to Resonance 参数 与其它产品相比 其他无...

发表于 2018-08-20 17:52 13次阅读
RI-RFM-008B RI-RFM-008B,...

RI-CTL-MB6B 具有 USB 和 RS4...

与其它产品相比 其他无线技术   Frequency Device Type Standard Transmission Principle Operating Temperature Range (C) Approx. Price (US$) Rating   var link = "zh_CN_folder_p_quick_link_description_features_parametrics"; com.TI.Product.handleQuickLinks('parametric','参数变化','#parametrics',link); RI-CTL-MB6B 134.2 kHz     Reader     N/A     N/A     -40 to 85     347.11 | 100u     Catalog    

发表于 2018-08-20 17:51 5次阅读
RI-CTL-MB6B 具有 USB 和 RS4...

继联电之后,台湾日月光半导体竟超越大陆五年?

发表于 2018-07-31 10:44 327次阅读
继联电之后,台湾日月光半导体竟超越大陆五年?

七种不同点胶阀的工作原理

发表于 2018-07-24 14:42 267次阅读
七种不同点胶阀的工作原理